0.5m (2ft) Generic Compatible 1.6T OSFP224 8 x 200G PAM4 Closed Finned Top Passive Direct Attach Copper Twinax Cable
0.5m (2ft) / Generic
Dhs. 1,721.23
Sale price
Dhs. 1,721.23
Regular price
Dhs. 2,409.72
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Description
FS's next generation octal small form-factor pluggable 1.6T DAC offers industry standard operations at 1600 Gbps complying with IEEE 802.3 Built for 224 Gbps-PAM4, these robust cables offer superior mechanical durability and excellent shielding to minimize crosstalk and deliver better signal integrity (SI) performance at a higher Nyquist frequency. The OSFP specification is designed to support high density applications, and is well suited for High-Performance Computing (HPC) and machine learning (ML) architectures. Note: This "Closed Finned Top" refers to a closed top design, which uses a finned-top but with a lid on top of the fins creating a closed channel for additional cooling. It is engineered to support both airflow cooling and liquid-cooled environments, offering enhanced mechanical protection and thermal compatibility in high-density systems.
0.5m (2ft) Generic Compatible 1.6T OSFP224 8 x 200G PAM4 Closed Finned Top Passive Direct Attach Copper Twinax Cable
Dhs. 1,721.23
Sale price
Dhs. 1,721.23
Regular price
Dhs. 2,409.72
FS's next generation octal small form-factor pluggable 1.6T DAC offers industry standard operations at 1600 Gbps complying with IEEE 802.3 Built for 224 Gbps-PAM4, these robust cables offer superior mechanical durability and excellent shielding to minimize crosstalk and deliver better signal integrity (SI) performance at a higher Nyquist frequency. The OSFP specification is designed to support high density applications, and is well suited for High-Performance Computing (HPC) and machine learning (ML) architectures. Note: This "Closed Finned Top" refers to a closed top design, which uses a finned-top but with a lid on top of the fins creating a closed channel for additional cooling. It is engineered to support both airflow cooling and liquid-cooled environments, offering enhanced mechanical protection and thermal compatibility in high-density systems.